Excellent...
Series: Nanostructure Science and Technology (Book 171)
Paperback: 292 pages
Publisher: Springer; Softcover reprint of the original 1st ed. 2014 edition (August 23, 2016)
Language: English
ISBN-10: 9781493953738
ISBN-13: 978-1493953738
ASIN: 1493953737
Product Dimensions: 6.1 x 0.7 x 9.2 inches
Format: PDF ePub TXT ebook
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book...
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This book offers vivid insights into policies of religious education in schools since the series of wars in former Yugoslavia in the 1990's. It traces the segregation among members of different ethnic
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